- High Performance thermal interface material
- Good bulk conductivity
- Excellent thermal impedance
- < 40 μ max particle diameter
- Non-silicone material
- Thin interface to offer low thermal resistance
- Good wet-out
3M™ Thermally Conductive Grease TCG-2035 is an ultra-high performance thermal interface material for transferring thermal energy from a heat source (e.g.: processor chip, graphics chip, etc.) to a heat sinking or heat spreading surface.
The 3M™ Thermally Conductive Greases are high performance thermal interface materials for transferring thermal energy from a heat source (e.g. processor chip, graphics chip, High Power LED) to a heat sink. The proprietary blend of inorganic fillers contained in an organic matrix (non-silicone) ensures high thermal conductivity and low thermal resistance. Grease products are available in two versions: Standard viscosity and a lower viscosity version that can be useful in screen printing application methods.