Features :-
- Good Thermal conductivity (0.6W/m-K)
- Electrically insulating
- Low Thermal impedance
- Good & reliable adhesion performance for aluminum (AI) & steel use stainless (SUS)
- Vibration damping
Applications :-
- General heat sink bonding
- IC chip packaging heat conduction
- Printed circuit board
- LED module/board bonding
- Flat panel display assembly
- COF chip heat conduction